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A
MICROSEMI
COMPANY
LX8610-xx
1A BiCMOS Very Low Dropout Regulators
PRELIMINARY DATASHEET
The LX8610 family are positive very low dropout regulators. They are designed to provide a power supply for very low headroom applications, such as 3.3V- 2.5V. BiCMOS technology allows an effective series pass element resistance, RDS(ON) of 250m

dropout voltage of 250mV at 1A. Low Quiescent Current and LogicControlled Shutdown help conserve battery life and increase system efficiency. Typical quiescent current is under 400A irrespective of load current, while the shutdown current is only 10A. The device will enter shutdown mode when the ENABLE pin is pulled low. Thermal & Short-Circuit Current Limiting: the LX8610 limits the current when the output is shorted, so protecting sensitive load circuits. The device will also turn off if the junction temperature exceeds 155C. Available in small outline SOT-223 and 8-pin SOIC: Adjustable versions use the 8-pin SOIC and fixed output voltage devices are supplied in the 3-lead SOT-223.

Dropout Voltage Typically
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250mA At 1A And 50mV At 10mA Low Quiescent Current, Under 400A, Irrespective Of Load Shutdown Current 10A Adjustable Output Version In 8-pin SOIC Package Fixed Outputs Of 2.5V, 3.3V Available In 3-Pin SOT-223 Package Low Reverse Leakage Current Short-Circuit And Thermal Shutdown Protection

3.3V & 2.5V Supplies For
IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com
Memory, Microprocessors, Clock Circuits, Etc. Portable Equipment

L X 86 1 0 -xx S im p lified B lock D ia gram
V IN
Current Lim it Reference Current Charge P um p RA
V OUT
A D J*
1 .2 5 V
RB
E N A B LE * GND
V IN /2
RA RB 25K 25K
Reverse V oltage S ense
L X 8 6 1 0-0 0
25K 41K
Therm al S hutdown
* A d ju sta b le 8 le a d ve rsio n on ly
L X 8 6 1 0-2 5 L X 8 6 1 0-3 3
LX8610-XX LX8610-XX

TJ (C)
0 to 125C
OUTPUT ST PLASTIC SOT-233 DM Plastic SOIC 8-PIN VOLTAGE 3-PIN
3.3 2.5 ADJ (00) LX8610-33CST LX8610-25CST - LX8610-33CDM LX8610-25CDM LX8610-00CDM
Note: Available in Tape & Reel. Append the letter "T" to the part number. (i.e. LX8610CDMT)
Copyright (c) 2000 Rev. 0.6f,2000-09-15
Microsemi
Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
A
MICROSEMI
COMPANY
LX8610-xx
1A BiCMOS Very Low Dropout Regulators
PRELIMINARY DATASHEET

Input Voltage (VIN) ......................................................................................................6.5V Enable Pin ..............................................................................................-0.3V to V IN+0.3V Operating Junction Temperature Plastic (ST & DM) Packages .................................125C Storage Temperature ................................................................................... -65C to 150C Lead Temperature (Soldering, 10 Seconds) ...............................................................300C

T A B IS G N D 3 V OU T
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2
GND
1
V IN
Note:
Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal.
ST PACKAGE (Top View)
V O UT 1 2 3 4 8 7 6 5 ADJ GND/ H E A T S IN K GND/ H E A T S IN K V IN

ST
PLASTIC SOT-223 PACKAGE 15C/W* 150C/W THERMAL RESISTANCE-JUNCTION TO TAB, JT THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA
GND/ H E A T S IN K GND/ H E A T S IN K E N A B LE
DM PACKAGE (Top View)
DM
PLASTIC SOIC PACKAGE 30C/W 90C/W
JLD THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA
THERMAL RESISTANCE-JUNCTION TO AMBIENT,

Junction Temperature Calculation: TJ = TA + (PD x JA). The JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. JA can be improved with package soldered copper area over backside ground plane or internal power plane. JA can vary from 45C/W > 75C/W depending on mounting technique. See table below for thermal resistance guidelines:
Copper Area (Topside)*
2.0 sq" (1290mm2) 1.0 sq" (645 mm2) 0.5 sq" (323 mm2) 0.25 sq" (161 mm2) 2.0 sq" (1290mm ) 1.0 sq" (645 mm2) 0.5 sq" (323 mm2) 0.25 sq" (161 mm2)
2
Copper Area (Backside)*
1.0 sq" (645 mm2) 0.5 sq" (323 mm2) 0.1 sq" (65 mm2) 0.1 sq" (65 mm2) 1.0 sq" (645 mm ) 0.5 sq" (323 mm2) 0.1 sq" (65 mm2) 0.1 sq" (65 mm2)
2
Board Area
2.0 sq" (1290mm2) 1.0 sq" (645 mm2) 0.5 sq" (323 mm2) 0.25 sq" (161 mm2) 2.0 sq" (1290mm ) 1.0 sq" (645 mm2) 0.5 sq" (323 mm2) 0.25 sq" (161 mm2)
2
Thermal Resistance (JA)
45C/W 50C/W 60C/W 70C/W 60C/W 67C/W 70C/W 75C/W
Possible Heat Sink Approaches using PCB Copper
ST (SOT-223)
1 2 3 4
8 7 6 5
PACKAGE DATA PACKAGE DATA
DM (SOIC)
*Tab of device attached to topside copper, or leads 2,3,5,6 of SOIC package
Copyright (c) 2000 Rev. 0.6f,2000-09-15
Microsemi
Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
A
MICROSEMI
COMPANY
LX8610-xx
1A BiCMOS Very Low Dropout Regulators
PRELIMINARY DATASHEET

VIN

Positive supply input for the regulator. Bypass to GND with at least 2.2F of low ESR, ESL capacitance if supply source is further than 1 inch from the device. Output for the regulator. It is recommended to bypass to GND with at least 10F although this is not required for regulation, rather it is needed for transient response. Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a larger capacitor will improve the response to these load steps. Reference ground. The input and output bypass capacitors should be connected to this pin. In addition the tab on the SOT-223 package and pins 2,3,6, and 7 on the SOIC package are also used for heat sinking the device. Feedback pin for the regulator. For the LX8610-00, the output voltage can be set by two external resistors with the following relationship: VOUT = 1.25V * (1 + RA / RB) where RA is the resistor connected between VOUT and ADJ, and RB is the resistor connected between ADJ and GND. Enable input. This pin has a threshold of about VIN / 2, it should be actively pulled high to enable the regulator. This can be accomplished with a resistive pull-up. When low, it turns off the regulator and puts the device in a low current shutdown state.
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VOUT
GND ADJ
ENALBE

VIN
5
IN
OUT
1
VOUT RA
CIN
LX8610-00
ENABLE
4
GND
2,3 6,7
ADJ
8
COUT RB
VREF
VOUT = VREF 1 +
RA RB
PIN DESCRIPTION PIN DESCRIPTION
Figure 1 - Typical Application
Copyright (c) 2000 Rev. 0.6f,2000-09-15
Microsemi
Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
A
MICROSEMI
COMPANY
Parameter
LX8610-xx
1A BiCMOS Very Low Dropout Regulators
PRELIMINARY DATASHEET

Symbol VIN Min 3 10 2.2 10 LX8610 Typ 5.5 1000 10 22* Max Units V mA F F
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Input Voltage Load Current (with adequate heatsinking) Input Capacitor (VIN to GND) Output Capacitor (VOUT to GND)
these load steps.
* Size your output capacitor to meet the transient loading requirement. If you have a very dynamic load, a larger capacitor will improve the response to
Unless otherwise specified, the following specifications apply over the operating ambient temperature 0C TA 125C except where otherwise noted. Test conditions: VIN = VOUT + 1.5V; IOUT = 10mA; CIN = 10F; COUT = 22F; TJ = TA. Parameter Symbol Test Conditions LX8610-xx Typ Max 3.3 4 5 0.25 0.15 0.05 1.25 400 400 0 VIN / 2 10 3.35 3.38 8 10 0.4 0.25 0.15 1.7 600 650 Units

Min 3.25 3.22
LX8610-33 FIXED 3.3V, 1A
Output Voltage Line Regulation Load Regulation Dropout Voltage (VDO = VIN-VOUT) Short Circuit Current Quiescent Current Reverse Leakage Current Shutdown Threshold * Shutdown Current *
VOUT VREG IREG VDO ISC IQ IREV VSD ISD
TJ = 25C Over Temperature VIN = 3.45V to 5.5V IOUT = 10mA to 1A IOUT = 1A, VOUT OUT -1% IOUT = 0.5A, VOUT OUT - 1% IOUT = 10mA, VOUT OUT - 1% VOUT = 0V IOUT = 10mA to 1A 0V < VIN < VOUT, VOUT <3.4V (at VOUT) OV < VIN < VOUT, VOUT <3.4V (at VIN) ENABLE < 0.8V
V mV mV V A A A mA V A
-50 0.8
25
LX8610-25 FIXED 2.5V, 1A
Output Voltage Line Regulation Load Regulation Dropout Voltage (VDO = VIN-VOUT) Short Circuit Current Quiescent Current Reverse Leakage Current Shutdown Threshold Shutdown Current
VOUT VREG IREG VDO ISC IQ IREV VSD ISD
TJ = 25C Over Temperature VIN = 3.1V to 5.5V, IOUT = -10mA IOUT = 10mA to 1A IOUT = 1A, VOUT OUT -1% IOUT = 0.5A, VOUT OUT - 1% IOUT = 10mA, VOUT OUT - 1% VOUT = 0V IOUT = 10mA to 1A 0V < VIN < VOUT, VOUT < 2.6V (at VOUT) 0V < VIN < VOUT, VOUT <2.6V (at VIN) ENABLE < 0.8V
2.46 2.44
-50 0.8
2.5 2.5 3 5 0.25 0.15 0.05 1.25 300 400 0 VIN / 2 10
2.54 2.56 6 10 0.4 .025 0.1 1.7 600 650
V mV mV V
E ELECTRICALS
25
A A A mA V A
Copyright (c) 2000 Rev. 0.6f,2000-09-15
Microsemi
Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
A
MICROSEMI
COMPANY
Symbol VREF VREG IREG ISC VDO IQ IREV IBIAS VSD ISD
LX8610-xx
1A BiCMOS Very Low Dropout Regulators
PRELIMINARY DATASHEET

Parameter Test Conditions Min LX8610-xx Typ Max Units
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LX8610-00 ADJUSTABLE OUTPUT, 1A
Reference Voltage Line Regulation Load Regulation Short Circuit Current Dropout Voltage (VDO = VIN-VOUT) Quiescent Current Reverse Leakage Current Bias Current at ADJ Pin Shutdown Threshold Shutdown Current
TJ = 25C Over Temperature VIN = VOUT + 150mV to 5.5V, IOUT = 10mA IOUT = 10mA to 1A VOUT = 0V IOUT = 1A, VIN > 4V IOUT = 0.5A, VIN > 3V IOUT = 10mA, VIN > 3V IOUT = 10mA to 1A, VIN = 5.5V 0V < VIN < VOUT, VOUT < 5.5V (at VOUT) 0V < VIN < VOUT, VOUT <5.5V (at VIN)
1.23 1.22
-50 0.8
ENABLE < 0.8V
1.22 1.25 2 7 1.25 0.25 0.15 0.05 400 400 0 100 (VIN / 2) 10
1.27 1.28 4 15 1.7 0.4 0.25 0.15 600 650
V mV mV A V A A mA nA V A
25
* Note: Enable threshold and Shutdown Current apply only to 8-Pin SOIC package outline versions

L X 8 6 1 0 D ro p o u t vs L o a d v s T e m p
350
300
250
200
150
0 25 75 100 125
100
E ELECTRICALS
50
0 0 0 .2 5 0 .5 0 .7 5 1
FIGURE 2 - Dropout Voltage Vs. Output Current (Typical - LX8610-25CST)
Copyright (c) 2000 Rev. 0.6f,2000-09-15
Microsemi
Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
A
MICROSEMI
COMPANY
D B1
LX8610-xx
1A BiCMOS Very Low Dropout Regulators
PRELIMINARY DATASHEET

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ST
3-Pin Plastic SOT-223
Dim A B B1 C D E F G H I J K L MILLIMETERS MIN MAX 1.55 1.80 0.65 0.85 2.95 3.15 0.25 0.35 6.30 6.70 3.30 3.70 2.30 BSC 4.60 BSC 6.71 7.29 - 0.91 0.02 0.10 10 MAX .084 1.04 INCHES MIN MAX 0.061 0.071 0.026 0.033 0.116 0.124 0.010 0.014 0.248 0.264 0.130 0.146 0.0905 BSC 0.181 BSC 0.264 0.287 - 0.036 .0008 .004 10 MAX 0.033 0.041
E 1 B F G 2 3
H
L K A J C I
DM
A
8-Pin Plastic SOIC
Dim A B C D F G J K L M P *LC
Note:
1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006") on any side. Lead dimension shall not include solder coverage.
P
B G L C D K J F M
MILLIMETERS MIN MAX 4.83 5.00 3.81 3.94 1.35 1.75 0.33 0.51 - 0.77 1.27 BSC 0.19 0.25 0.13 0.25 4.80 5.21 - 8 5.79 6.20 - 0.10
INCHES MIN MAX 0.190 0.197 0.150 0.155 0.053 0.069 0.013 0.020 - 0.030 0.050 BSC 0.007 0.010 0.005 0.010 0.189 0.205 - 8 0.228 0.244 - 0.004
M MECHANICALS
*Lead Coplanarity
Preliminary Data - Information contained in this document is pre-production data and is proprietary to LinFinity. It may not be modified in any way without the express written consent of LinFinity. Product referred to herein is offered in sample form only and LinFinity reserves the right to change or discontinue this proposed product at any time.
Copyright (c) 2000 Rev. 0.6f,2000-09-15
Microsemi
Linfinity Microelectronics Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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